1、The design describes the structure of compound die stamping flip-chip design and working process.
本次設(shè)計(jì)闡述了沖壓倒裝復(fù)合模的結(jié)構(gòu)設(shè)計(jì)以及工作過(guò)程。

2、In addition, both the working process of compound die and questions required attention are stated.
同時(shí)也闡述了復(fù)合模工作過(guò)程及注意事項(xiàng)。

3、The structure and machining process of plane diffluent compound die are introduced.
介紹了平面分流組合模的結(jié)構(gòu)和加工工藝。

4、Belling-cold Extrusion Compound Die Design of Locating Ring Boss
鎖扣凸臺(tái)的壓凸—冷擠復(fù)合模設(shè)計(jì)

compound die翻譯